Xilinx SP601 User Manual download pdf (Page 14)

14 www.xilinx.com SP601 Hardware User Guide

UG518 (v1.1) August 19, 2009

Chapter 1: SP601 Evaluation Board

References

See the Xilinx Spartan-6 FPGA documentation for more information at

http://www.xilinx.com/support/documentation/spartan-6.htm

2. 128 MB DDR2 Component Memory

There are 128 MB of DDR2 memory available on the SP601 board. A 1-Gb Elpida

EDE1116ACBG (84-ball) DDR2 memory component is accessible through Bank 3 of the

LX16 device. The Spartan-6 FPGA hard memory controller is used for data transfer across

the DDR2 memory interface's 16-bit data path using SSTL18 signaling. The maximum data

rate supported is 800 Mb/s with a memory clock running at 400 MHz. Signal integrity is

maintained through DDR2 resistor terminations and memory on-die terminations (ODT),

as shown in Table 1-3 and Table 1-4.

22.5V

31.8V

Table 1-2: I/O Voltage Rail of FPGA Banks (Cont’d)

FPGA Bank I/O Voltage Rail

Table 1-3: Termination Resistor Requirements

Signal Name Board Termination On-Die Termination

DDR2_A[14:0] 49.9 ohms to V

DDR2_BA[2:0] 49.9 ohms to V

DDR2_RAS_N 49.9 ohms to V

DDR2_CAS_N 49.9 ohms to V

DDR2_WE_N 49.9 ohms to V

DDR2_CS_N 100 ohms to GND

DDR2_CKE 4.7K ohms to GND

DDR2_ODT 4.7K ohms to GND

DDR2_DQ[15:0] ODT

DDR2_UDQS[P,N],

DDR2_LDQS[P,N]

ODT

DDR2_UDM, DDR2_LDM ODT

DDR2_CK[P,N]

100 ohm differential at

memory component

Notes:

1. Nominal value of V

for DDR2 interface is 0.9V.

Table 1-4: FPGA On-Chip (OCT) Termination External Resistor Requirements

FPGA U1 Pin FPGA Pin Number Board Connection for OCT

ZIO L6 No Connect

RZQ C2 100 ohms to GROUND

1 2 ... 9 10 11 12 13 14 15 16 17 18 19 ... 54 55

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